Micro-crack inspection in heterogeneously textured solar wafers using anisotropic diffusion

Author:

Tsai Du-Ming,Chang Chih-Chieh,Chao Shin-Min

Publisher

Elsevier BV

Subject

Computer Vision and Pattern Recognition,Signal Processing

Reference38 articles.

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2. Maximum likelihood unsupervised textured image segmentation;Cohen;CVGIP: Graphical Models Image Processing,1992

3. A modular artificial neural network for texture processing;Van Hulle;Neural Networks,1993

4. Textural features for image classification;Haralick;IEEE Transactions on Systems, Man and Cybernetics,1973

5. Identifying and locating surface defects in wood;Conners;IEEE Transactions on Pattern Analysis and Machine Intelligence,1983

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