Synthesis of a fully capped mesoporous silica and its hybrids with extremely low dielectric constant and loss
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,Condensed Matter Physics,General Materials Science,General Chemistry
Reference48 articles.
1. Low-k Periodic Mesoporous Organosilica with Air Walls: POSS-PMO
2. Mechanical properties of a plasma-modified porous low-k material
3. Ultra-low-k cyclic carbon-bridged PMO films with a high chemical resistance
4. Effect of surfactants on the porogen size in the low-k methylsilsesquioxane/polystyrene hybrid films
5. Effects of porous carbon additives and induced fluorine on low dielectric constant polyimide synthesized with an e-beam
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2. Design of ultra-microporous COF for effectively enhancing the dielectric and fire resistance of bismaleimide based electronic packaging material;Chemical Engineering Journal;2024-02
3. Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber;Chemical Engineering Journal;2022-07
4. Development and mechanism of ultralow dielectric loss and toughened bismaleimide resins with high heat and moisture resistance based on unique amino-functionalized metal-organic frameworks;Composites Part B: Engineering;2018-01
5. High-temperature microwave absorbing properties of ordered mesoporous inter-filled SiC/SiO2 composites;Ceramics International;2017-01
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