Formation of interfacial microstructure in brazing of Si3N4 with Ti-activated Ag-Cu filler alloys
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference15 articles.
1. Joining of Si3N4 using Ag57Cu38Ti5 brazing filler metal
2. Transitional Phases at Ceramic-Metal Interfaces: Orthorhombic, Cubic, and Hexagonal Ti-Si-Cu-N Compounds
3. Bonding Mechanisms in Silicon Nitride Brazing
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1. Effect of interfacial microstructure evolution on the peeling strength and fracture of silicon nitride/oxygen-free copper foil joints brazed with Ag-Cu-TiH2 filler;Journal of the European Ceramic Society;2023-08
2. Unveiling the reaction products in heat treated Si3N4-Ti joined ceramics by transmission electron microscopy;Journal of Advanced Ceramics;2019-12
3. Microstructure and Shear Strength of Brazing TiAl/Si3N4 Joints with Ag-Cu Binary Alloy as Filler Metal;Metals;2018-11-02
4. Influence of interfacial reaction on reactive wettability of molten Ag-Cu-X wt.%Ti filler metal on SiC ceramic substrate and mechanism analysis;Applied Surface Science;2018-04
5. Wetting of AgCu-Ti filler on porous Si3N4 ceramic and brazing of the ceramic to TiAl alloy;Ceramics International;2018-04
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