Effect of interfacial microstructure evolution on the peeling strength and fracture of silicon nitride/oxygen-free copper foil joints brazed with Ag-Cu-TiH2 filler-Reference-Cited by-同舟云学术

Effect of interfacial microstructure evolution on the peeling strength and fracture of silicon nitride/oxygen-free copper foil joints brazed with Ag-Cu-TiH2 filler

Published:2023-08 Issue:10 Volume:43 Page:4374-4385
ISSN:0955-2219
Container-title:Journal of the European Ceramic Society
language:en
Short-container-title:Journal of the European Ceramic Society

Author:

Tang Liangliang,Yao Dongxu,Xia Yongfeng,Liang Hanqin,Zeng Yu-Ping

Funder

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Shanghai Rising-Star Program

National Natural Science Foundation of China

Chinese Academy of Sciences

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Reference39 articles.

1. Present status and future prospect of widegap semiconductor high-power devices;Okumura;Jpn. J. Appl. Phys.,2006

2. Materials science. Silicon carbide as a platform for power electronics;Eddy;Science,2009

3. State of the art of high temperature power electronics;Buttay;Mater. Sci. Eng.: B,2011

4. Thermal management on IGBT power electronic devices and modules;Qian;IEEE Access,2018

5. Cyclic thermal stress-induced degradation of Cu metallization on Si3N4 substrate at −40°C to 300°C;Lang;J. Electron. Mater.,2014

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