Author:
Singh R.,Radu I.,Reiche M.,Himcinschi C.,Kuck B.,Tillack B.,Gösele U.,Christiansen S.H.
Funder
Bundesministerium für Bildung und Forschung
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Cited by
1 articles.
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1. Vertical metal interconnect thanks to tungsten direct bonding;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010-06