Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates-Reference-Cited by-同舟云学术

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

Published:2017-07 Issue: Volume:411 Page:82-90
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Xiang Jing,Wang Chong,Chen Yuanming,Wang Shouxu,Hong Yan,Zhang Huaiwu,Gong Lijun,He Wei

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference46 articles.

1. Embedded active device packaging technology for next-generation chip-in-substrate package, CiSP;Ko;Electronic Components & Technology Conference,2006

2. Wire bonding using copper wire;Zhong;Microelectron. Int.,2009

3. Trends in assembling of advanced IC packages;Kisiel;J. Telecommun. Inf. Technol.,2005

4. Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array;Kam;IEEE Des. Test Comput.,2006

5. A Coreless Technology Overview for Packaging Substrates;Hsu,2010

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Regulation of copper electrodeposition and its application in chip manufacturing;SCIENTIA SINICA Chimica;2023-08-11

2. The roles of plasma science towards plasma-activated reflow soldering on Cu substrate with organic solderability preservatives surface finish;Surfaces and Interfaces;2022-11

3. Ingenious Sandwich-like Adhesive Films and Controllable Introduction of Fluorine-Containing Groups toward Strong Adhesive Strength and Low Dielectric Characteristics;Industrial & Engineering Chemistry Research;2022-09-22

4. 8-inch wafer-level electroplating of nanotwinned copper redistribution layer for advanced packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

5. Characterization and modeling of a typical curing material for photoresist films;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25