Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding-Reference-Cited by-同舟云学术

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Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding

Published:2021-06 Issue: Volume:551 Page:149396
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Min Kyung Deuk,Lee Choong-Jae,Hwang Byeong-Uk,Kim Jae-Ha,Jang Jun-Ho,Jung Seung-Boo

Funder

Kementerian Pendidikan Malaysia

National Research Foundation of Korea

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference21 articles.

1. Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol;Bhogaraju;Scr. Mater.,2020

2. Trends in automotive power semiconductor packaging;Dietrich;Microelectron. Reliab.,2013

3. Die-attaching silver paste based on a novel solvent for high-power semiconductor devices;Jiu;J. Mater. Sci.,2016

4. Preparation of PVP coated Cu NPs and the application for low-temperature bonding;Yan;J. Mater. Chem.,2011

5. Joining technology innovations at the macro, micro, and nano levels;Hu;Appl. Sci.,2019

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of microstructures and fractures in Ag–In transient liquid phase bonded joints;Materials Science and Engineering: A;2024-02

2. Trace of Ag atoms migration induced by temperature gradient in Cu/Sn-5.0Ag/Cu solder joints;Materials Characterization;2024-02

3. Interfacial reactions between In and Ag during solid liquid interdiffusion process;Surfaces and Interfaces;2024-02

4. Effect of Different Proportions and Powder Sizes of Sn on The Performance of Cu-Sn TLPB Joints;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

5. Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times;Materials Characterization;2022-12

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