Author:
Cui Hao,Park Jin-Hyung,Park Jea-Gun
Funder
Hanyang University and Samsung Electronics Co. Ltd.
Korean Ministry of Knowledge and Economy
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference27 articles.
1. Modification of electrokinetic behavior of CeO2 abrasive particles in chemical mechanical polishing for shallow trench isolation;Kim;Journal of the Korean Physical Society,2001
2. Effect of crystallinity of ceria particles on the PETEOS removal rate in chemical mechanical polishing for shallow trench isolation;Kim;Journal of the Korean Physical Society,2002
3. The effect of CeO2 abrasive size on dishing and step height reduction of silicon oxide film in STI–CMP;Lim;Surface and Coatings Technology,2005
4. High-removal selectivity through interaction between polyacrylamide and SiO2 film in poly isolation chemical mechanical planarization;Kim;Journal of Nanoscience and Nanotechnology,2009
5. Milestones in a quarter century of CMP – plenary;Fury;ECS Transactions,2009
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