Effect of various additives on morphological and structural characteristics of pulse electrodeposited tin coatings from stannous sulfate electrolyte

Author:

Sharma Ashutosh,Das Karabi,Fecht Hans-J.,Das Siddhartha

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference18 articles.

1. Lead free solders in microelectronics;Abtew;Mater. Sci. Eng. R,2000

2. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid State Mater. Sci.,2001

3. Handbook of Lead Free Solder Technology for Microelectronic Assemblies;Puttlitz,2004

4. Influence of current density on the microstructure of pulse electrodeposited tin coatings;Sharma;Mater. Charact.,2012

5. Surface morphology and crystal orientation of electrodeposited tin from acid stannous sulphate solutions containing various additives;Nakamura;J. Appl. Electrochem.,1994

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