The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment-Reference-Cited by-同舟云学术

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The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment

Published:2005-12 Issue:5 Volume:252 Page:1818-1825
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Yang Chih-hao,Lee Shih-chin,Wu Jun-ming,Lin Tien-chai

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference23 articles.

1. Flexible Circuit Technology;Fjelstad,1998

2. Adhesion and deformation of metal/polyimide layered structures

3. Effect of oxygen plasma etching on adhesion between polyimide films and metal

4. Surface modification of Kapton film by plasma treatments

5. Improved adhesion between plasma-treated polyimide film and evaporated copper

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1. Effect of oxygen on the discharge characteristics of argon doped ethanol plasma jet and its application in surface modification of polyimide films;Plasma Sources Science and Technology;2024-09-01

2. Circular economy-driven additive manufacturing: A model for recycling PLA/copper composites through multi-extrusion processing;Journal of Industrial and Engineering Chemistry;2024-02

3. Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification;Journal of Adhesion Science and Technology;2024-01-11

4. Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma;Materials;2023-09-14

5. Reliability Aspects and Study of Copper Seed Deposition on Polyimide via Sputtering;2023 37th Symposium on Microelectronics Technology and Devices (SBMicro);2023-08-28

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