Adhesion and deformation of metal/polyimide layered structures
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.342903
Reference8 articles.
1. Packaging Technology for the NEC SX Supercomputer
2. Direct Measurements of the Surface Energies of Crystals
3. Elasto-Plastic Analysis of the Peel Test for Thin Film Adhesion
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