Enhancing accuracy to Stoney equation-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Enhancing accuracy to Stoney equation

Published:2009-04 Issue:12 Volume:255 Page:6426-6428
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Pureza J.M.,Lacerda M.M.,De Oliveira A.L.,Fragalli J.F.,Zanon R.A.S.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference28 articles.

1. How accurate are Stoney’s equation and recent modifications

2. Elastic relationships in layered composite media with approximation for the case of thin films on a thick substrate

3. Applicability of the classical curvature‐stress relation for thin films on plate substrates

4. The rise of graphene

5. Determination of thin-film stresses on round substrates

Cited by 37 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Resolving the hardness–toughness trade‐off dilemma of metal/ceramic multilayer films by introducing gradient structure;Journal of the American Ceramic Society;2024-08-29

2. Optimization of Substrate Sizes for In Situ Stress Measurement in Electrodeposits Relying on Nonlinear Effects;Coatings;2023-11-30

3. Effect of HG40 and HS123 hard alloy tool substrates on the properties of hardening coating;Powder Metallurgy аnd Functional Coatings;2023-09-23

4. Elliptically polarized light photoelasticity based on LCD;Optics Express;2023-08-09

5. Dual-phase nanostructure of amorphous carbon and TaCB solid solution: Robust high-performance protective coating for marine equipment;Ceramics International;2023-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3