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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

  • Published:2019-11 Issue: Volume:495 Page:143487
  • ISSN:0169-4332
  • Container-title:Applied Surface Science
  • language:en
  • Short-container-title:Applied Surface Science

Author:

Jung Kwang-Ho,Min Kyung Deuk,Lee Choong-Jae,Park Bum-Geun,Jeong Haksan,Koo Ja-Myeong,Lee Byunghoon,Jung Seung-BooORCID

Funder

National Research Foundation of Korea

Ministry of Education

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference35 articles.

1. Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium;Yang;J. Alloy. Compd.,2018

2. Microstructural evolution of Ni-Sn transient liquid phase sintering bond during high-temperature aging;Feng;J. Electron. Mater.,2018

3. Low-temperature sintering bonding using silver nanoparticle paste for electronics packaging;Guo;J. Nanomater.,2015

4. Mechanical properties of nano-silver joints as die attach materials;Siow;J. Alloy. Compd.,2012

5. High temperature capacitors and transient liquid phase interconnects for Pb-solder replacement;Bultitude;J. Mater. Sci. Mater. Electron.,2015

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