Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach-Reference-Cited by-同舟云学术

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Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

Published:2023-07 Issue:19 Volume:34 Page:
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Son Junhyuk,Yu Dong-Yurl,Kim Yun-Chan,Kim Shin-Il,Byun Dongjin,Bang JungHwan

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s10854-023-10833-9.pdf

Reference30 articles.

1. J.N. Calata, J.G. Bai, X. Liu, S. Wen, G.Q. Lu, IEEE Trans. Adv. Packag. 28, 404 (2005)

2. R. Singh, Microelectron. Reliab. 46, 713 (2006)

3. U.K. Mishra, L. Shen, T.E. Kazior, Y.F. Wu, Proc. IEEE 96, 287 (2008)

4. J. Biela, M. Schweizer, S. Waffler, J.W. Kolar, IEEE Trans. Ind. Electron. 58, 2872 (2011)

5. L. Coppola, D. Huff, F. Wang, R. Burgos, D. Boroyevich, IEEE Power Electron. Spec. Conf. IEEE (2007). https://doi.org/10.1109/PESC.2007.4342356

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1. Low-temperature copper sinter-joining technology for power electronics packaging: A review;Journal of Materials Processing Technology;2024-11

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