Decomposition of organic additives in the oxidative chalcopyrite leaching with hydrogen peroxide
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Geotechnical Engineering and Engineering Geology,General Chemistry,Control and Systems Engineering
Reference41 articles.
1. Dissolution kinetics of chalcopyrite with hydrogen peroxide in sulphuric acid medium;Adebayo;Chem. Biochem. Eng. Quart.,2003
2. Degradation of atrazine by Fenton's reagent: condition optimization and product quantification;Arnold;Environ. Sci. Technolo.,1995
3. Chalcopyrite leaching with hydrogen peroxide in formic acid medium;Arslanoglu;Trans Indian Inst Met,2020
4. Oxidative degradation of polysorbate surfactants studied by liquid chromatography–mass spectrometry;Borisov;J. Pharm. Sci.,2015
5. Critical review of rate constants for reactions of hydrated electrons, hydrogen atoms and hydroxyl radicals (⋅ OH/⋅ O− in aqueous solution;Buxton;J. Phys. Chem. Ref. Data,1988
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Nanoscale Component Diffusion Study of InP/SiC Heterogeneous Bonding Interface for High-Quality Optoelectronic Device Integration;ACS Applied Nano Materials;2024-09-09
2. High-efficiency leaching of chalcopyrite by ozone with ultrasonic promotion: Kinetics and mechanism;Journal of Molecular Liquids;2024-05
3. Chalcopyrite Leaching in the Presence of Isopropanol—The Kinetic and Mechanistic Studies;Materials;2024-02-08
4. Effect of oxidizing agents on the treatment of a Colombian lead ore by alternative hydrometallurgical processes;Journal of Mining and Metallurgy, Section B: Metallurgy;2024
5. 从铜渣中获得工业醋酸铜(II)溶液的常压浸出条件和浸出动力学研究;Journal of Central South University;2023-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3