Author:
Vallin Örjan,Jonsson Kerstin,Knechtel Roy
Reference22 articles.
1. Adhesion quantification methods for wafer bonding;Vallin;Mater. Sci. Eng. R: Rep.,2005
2. A review of hydrophilic silicon wafer bonding;Masteika;ECS J. Solid State Sci. Technol.,2014
3. Low-temperature plasma activated bonding for a variable optical attenuator;Schølberg-Henriksen;Sens. Actuators A: Phys.,2008
4. R. Knechtel, Characterization and qualification of wafer-bonded MEMS devices, in: ECS Transactions, vol. 16, Honolulu, HI, 2008, pp. 417–424.
5. Stress Intensity Factors Handbook, vols. 1 and 2,1987
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献