Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Aerospace Engineering,Nuclear Energy and Engineering,General Chemical Engineering
Reference28 articles.
1. Thermal management of electronic components with dielectric liquids;Bar-Cohen;JSME Int. J.,1993
2. S. Oktay, Departure from natural convection (DNC) in low-temperature boiling heat transfer encountered in cooling micro-electronic LSI devices, in: Proc. 7th Int. Heat Transfer Conf., vol. 4, 1982, pp. 113–118
3. S. Oktay, A. Schmekenbecher, Method for forming heat sinks on semiconductor device chips, US Patent No. 3,706,127, 1972
4. Boiling heat transfer of silicon integrated circuits chip mounted on a substrate;Hwang,1981
5. Effects of boiling history on a micro-configured surface in a dielectric liquid;Miller;Int. Commun. Heat Mass Transfer,1990
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