Experimental analysis and simulation of passive flexible heat transfer device-Reference-Cited by-同舟云学术

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Experimental analysis and simulation of passive flexible heat transfer device

Published:2024-05 Issue: Volume:199 Page:108902
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Pandi Kannan^ORCID,Jaganathan V.M.,Suresh S.,S.R. Akhil Krishnan^ORCID

Publisher

Elsevier BV

Reference35 articles.

1. Enhanced boiling heat transfer from electronic components by use of surface microstructures;Honda;Exp. Therm Fluid Sci.,2004

2. 3D study of convection-radiation heat transfer of electronic chip inside enclosure cooled by heat sink;Hassan;Int. J. Therm. Sci.,2021

3. Electronics thermal management in information and communications technologies: Challenges and future directions;Garimella;IEEE Trans. Compon., Packag. Manuf. Technol.,2016

4. Review on flexible photonics/electronics integrated devices and fabrication strategy;Cai;Sci. China Inf. Sci.,2018

5. Low profile fan and heat sink thermal management solution for portable applications;Walsh;Int. J. Therm. Sci.,2007

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improvement in Laptop Heat Dissipation with Taguchi Method;Electronics;2024-02-25

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