Polishing of polycrystalline diamond by the technique of dynamic friction. Part 2: Material removal mechanism

Author:

Chen Y.,Zhang L.C.,Arsecularatne J.A.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference44 articles.

1. Polishing of polycrystalline diamond by the technique of dynamic friction, part 1: prediction of the interface temperature rise;Chen;International Journal of Machine Tools and Manufacture,2006

2. Dynamic friction polishing of diamond utilizing sliding wear by rotating metal disc;Suzuki;Proceedings of ASPE,1996

3. High efficiency polishing of PCD with rotating metal disc;Iwai;Proceedings of ISAAT2001,2001

4. Material removal mechanism in dynamic friction polishing of diamond;Suzuki;Key Engineering Materials,2003

5. M. Iwai, Y. Takashima, K. Suzuki, T. Uematsu, Investigation of polishing condition in dynamic friction polishing method for diamond, in: Seventh International Symposium on Advances in Abrasive Technology, Buras, Turkey, 2004.

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