Material Removal Mechanism in Dynamic Friction Polishing of Diamond-Reference-Cited by-同舟云学术

Material Removal Mechanism in Dynamic Friction Polishing of Diamond

Published:2003-04 Issue: Volume:238-239 Page:235-240
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Suzuki Kiyoshi¹,Iwai Manabu²,Uematsu Tetsutaro²,Yasunaga Nobuo³

Affiliation:

1. Nippon Institute of Technology

2. Toyama Prefectural University

3. Tokai University

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.238-239.235.pdf

Reference6 articles.

1. K. Suzuki, N. Yasunaga, T. Uematsu et al.: Dynamic friction polishing of diamond utilizing sliding wear by rotating metal disc, Proc. of ASPE (1996) 482-485.

2. M. Iwai, T. Uematsu, K. Suzki, N. Yasunaga: High efficiency polishing of PCD with rotating metal disc, Proc. of ISAAT2001 (2001) 231-238.

3. N. Ikawa, T. Tanaka: Wear of diamond abrasive grain in grinding pure iron, Journal of JSPE, 37-11 (1971) 824-828 (in Japanese).

4. N. Yasunaga et al.: Generation of cementite in the reaction of diamond / pure iron, - An experiment for wear of diamond -, Journal of JSPE, 38-4 (1972) 413-415 (in Japanese).

5. C.F. Yang, M. Yoshikawa: On polishing of diamond film with hot metal (The optimum polishing condition), Journal of JSPE, 57-1 (1991) 184-189 (in Japanese).

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