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Analysis of grit interference mechanisms for the double scratching of monocrystalline silicon carbide by coupling the FEM and SPH

  • Published:2017-09 Issue: Volume:120 Page:49-60
  • ISSN:0890-6955
  • Container-title:International Journal of Machine Tools and Manufacture
  • language:en
  • Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Duan Nian,Yu Yiqing,Wang Wenshan,Xu Xipeng

Funder

National Natural Science Foundation of China

Specialized Research Fund for the Doctoral Program of Higher Education

Major Projects from the Department of Education in Fujian Province/China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference20 articles.

1. Grinding Technology: Theory and Application of Machining with Abrasives[M];Malkin,1989

2. Elastic/plastic indentation on damage in ceramics: the lateral crack system;Marshall;J. Am. Ceram. Soc.,1982

3. Grinding induced subsurface cracks in silicon wafers;Pei;Int. J. Mach. Tools Manuf.,1999

4. Lateral crack in abrasive wear of brittle materials;Ahn;JSME Int. J. Ser. A-Solid Mech. Mater. Eng.,2003

5. M.V. Swain, Microfracture about scratches in brittle solids, Proceedings of the Royal Society of London Series A 366575-597, 1979.
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