Thermal-aware processing-in-memory instruction offloading-Reference-Cited by-同舟云学术

Thermal-aware processing-in-memory instruction offloading

Published:2019-08 Issue: Volume:130 Page:193-207
ISSN:0743-7315
Container-title:Journal of Parallel and Distributed Computing
language:en
Short-container-title:Journal of Parallel and Distributed Computing

Author:

Nai Lifeng^ORCID,Hadidi Ramyad,Xiao He,Kim Hyojong^ORCID,Sim Jaewoong^ORCID,Kim Hyesoon

Publisher

Elsevier BV

Subject

Artificial Intelligence,Computer Networks and Communications,Hardware and Architecture,Theoretical Computer Science,Software

Reference48 articles.

1. PIM-enabled instructions: A low-overhead, locality-aware processing-in-memory architecture;Ahn,2015

2. E. Azarkhish, D. Rossi, I. Loi, L. Benini, High performance AXI-4.0 based interconnect for extensible smart memory cubes, in: DATE’15, 2015, pp. 1317–1322, http://dx.doi.org/10.7873/DATE.2015.0054.

3. Y. Eckert, N. Jayasena, G.H. Loh, Thermal feasibility of die-stacked processing in memory, in: The 2nd Workshop on Near-Data Processing, WoNDP, WoNDP’14, 2014.

4. Roadmaps of Packaging Technology;Eric Bogatin,1997

5. The LDBC social network benchmark: Interactive workload;Erling,2015

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Simulation of ML Applications on a Commercial DRAM-Based PIM;2024 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC);2024-07-02

2. Thermal Analysis of Microfluidic cooling in Processing-in-3D-Stacked Memory;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19

3. A Survey of Resource Management for Processing-In-Memory and Near-Memory Processing Architectures;Journal of Low Power Electronics and Applications;2020-09-24

4. Making Better Use of Processing-in-Memory Through Potential-Based Task Offloading;IEEE Access;2020

5. Special issue: Selected papers from IPDPS’18;Journal of Parallel and Distributed Computing;2019-11