Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC:H thin films-Reference-Cited by-同舟云学术

Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC:H thin films

Published:2013-11 Issue: Volume:379 Page:67-79
ISSN:0022-3093
Container-title:Journal of Non-Crystalline Solids
language:en
Short-container-title:Journal of Non-Crystalline Solids

Author:

King Sean W.,Bielefeld Jeff,Xu Guanghai,Lanford William A.,Matsuda Yusuke,Dauskardt Reinhold H.,Kim Namjun,Hondongwa Donald,Olasov Lauren,Daly Brian,Stan Gheorghe,Liu Ming,Dutta Dhanadeep,Gidley David

Publisher

Elsevier BV

Subject

Materials Chemistry,Condensed Matter Physics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference187 articles.

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4. Development and Characterization of a PECVD Silicon Nitride for Damascene Applications

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