Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference158 articles.
1. Wire bonding in microelectronics: materials, processes, reliability and yield;Harman,1997
2. Metal forming progress since 2000
3. Ultrasonic nanowelding of carbon nanotubes to metal electrodes
4. Mayer M, Schwizer J. In: Proceedings of the international symposium on microelectronics (IMAPS), Denver; 2002.
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