Nanostructure and adhesion of electroless-plated Cu film on the self-catalyzed Cu using metal-plasma ion implanter-Reference-Cited by-同舟云学术

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Nanostructure and adhesion of electroless-plated Cu film on the self-catalyzed Cu using metal-plasma ion implanter

Published:2005-08 Issue:1-2 Volume:237 Page:470-476
ISSN:0168-583X
Container-title:Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms

Author:

Chen Uei-Shin,Hsieh Wei-Jen,Shih Han C.,Chang Yee-Shyi,Weng Ko-Wei,Wang Da-Yung

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference17 articles.

1. Effects of copper seedlayer deposition method for electroplating

2. Sn/Pd Catalyzation and Electroless Cu Deposition on TaN Diffusion Barrier Layers

3. Integrated electroless metallization for ULSI

4. The effect of pressure control on a thermally stable a-C:N thin film with low dielectric constant by electron cyclotron resonance-plasma

5. Gap-filling capability and adhesion strength of the electroless-plated copper for submicron interconnect metallization

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cryogenic Performance of Adhesively Bonded Metal Joints for LNG Containment System;Journal of Adhesion Science and Technology;2012-04-01

2. Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications;Journal of The Electrochemical Society;2009

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