Preparation, Transmission Electron Microscopy, and Microanalytical Investigations of Metal-III-V Semiconductor Interfaces

Author:

Klein A.,Urban I.,Ressel P.,Nebauer E.,Merkel U.,Österle W.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference8 articles.

1. Ohmic behavior of Au/WSiN/(Au,Ge,Ni)-n-GaAs systems;Merkel;Thin Solid Films,1992

2. RTA-Treated Ohmic Contacts to GaAs Containing WSiN Barriers;Nebauer;Proc. MRS Spring Meeting, San Francisco, CA (April 17–21, 1995),1995

3. Ohmic contact study for quantum effect transistors and heterojunction bipolar transistors with InGaAs contact layers;Chen;J. Vac. Sci. Technol. B.,1992

4. Electron microscope studies of an alloyed Au/Ni/Au-Ge ohmic contact to GaAs;Kuan;J. Appl. Phys.,1983

5. Microstructure of Metal-GaAs Interfaces;Kuan;Proc. MRS Fall Meeting, Boston, MA (December 2–6, 1985),1986

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