1. Effect of aging on fatigue crack growth at Sn-Pb/Cu interfaces;Yao;Metall. Mater. Trans,1995
2. The growth of Cu-Sn intermetallics at a pretinned copper-solder interface;Sunwoo;Metall. Trans,1992
3. Solder joint reliability of flip chip and plastic ball grid arrar assembly under thermal, mechanical, and vibrational conditions;Lau;IEEE Trans. Comp., Hybrid, Manufact. Technol.,1996
4. Effects of cooling rate on interfacial fatigue-crack growth in Sn-Pb solder joints;Yao;IEEE Trans. Comp., Hybrid, Manufact. Technol.,1996
5. Y. Y. Wei, J. G. Duh, Y. G. Lee, and B. S. Chiou: 1998 Proceedings Pan Pacific Microelectronics Symposium. Proc. Int. Conf. on Surface Mount Technology Association, Kona, Hawaii, USA, pp. 483–488 (Feb. 10–13, 1998).