Mechanistic understanding of enhanced thermal stability of twinned copper nanowires
Author:
Funder
Industrial Technology Research Institute
National Science and Technology Council
Publisher
Elsevier BV
Reference52 articles.
1. Self-annealing characterization of electroplated copper films;Lagrange;Microelectron. Eng.,2000
2. Hall-Petch strengthening in nanocrystalline metals;Weertman;Mater. Sci. Eng., A,1993
3. The Hall–Petch and inverse Hall–Petch relations and the hardness of nanocrystalline metals;Naik;J. Mater. Sci.,2020
4. Grain boundary contribution to the electrical conductivity of polycrystalline Cu films;Mannan;J. Phys. F Met. Phys.,1975
5. Revealing the maximum strength in nanotwinned copper;Lu;Science,2009
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