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Reduction of Thermomechanical Stress Using Electrically Conductive Adhesives

  • Published:2015-08 Issue: Volume:77 Page:346-355
  • ISSN:1876-6102
  • Container-title:Energy Procedia
  • language:en
  • Short-container-title:Energy Procedia

Author:

Geipel Torsten,Rendler Li Carlos,Stompe Manuel,Eitner Ulrich,Rissing Lutz

Publisher

Elsevier BV

Reference23 articles.

1. 24.7% Record Efficiency HIT Solar Cell on Thin Silicon Wafer;Taguchi;IEEE J. Photovoltaics,2014

2. Advanced module fabrication of silicon heterojunction solar cells using anisotropic conductive film method;Choi;26th EUPVSEC.,2011

3. Hetero-junction module technology;Späth;26th EUPVSEC.,2011

4. 17.9% Metal-wrap-through mc-Si cells resulting in module efficiency of 17.0%;Lamers;Prog. Photovolt: Res. Appl.,2012

5. Low-stress interconnection of solar cells;Bennett;22nd EUPVSEC.,2007

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1. In situ quantification of temperature and strain within photovoltaic modules through optical sensing;Progress in Photovoltaics: Research and Applications;2022-09-17

2. Wave-shaped wires for the interconnection of silicon solar cells without pads or busbars;2ND INTERNATIONAL CONFERENCE ON EMERGING SMART MATERIALS IN APPLIED CHEMISTRY (ESMAC-2021): ESMAC-2021;2022

3. FEM simulation of deformations and stresses in strings of shingled solar cells under mechanical and thermal loading;PROCEEDINGS OF THE 10TH WORKSHOP ON METALLIZATION AND INTERCONNECTION FOR CRYSTALLINE SILICON SOLAR CELLS;2022

4. Stress and strain within photovoltaic modules using the finite element method: A critical review;Renewable and Sustainable Energy Reviews;2021-07

5. Effect of electric field-induced alignment of conductive fillers in polyurethane;Materials Chemistry and Physics;2021-07
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