Author:
Urban Tobias,Mette Ansgar,Heitmann Johannes
Reference6 articles.
1. Analysis of Ohmic Losses Due to Solder and Pressure Interconnection and Related Interface Resistances for Solar Cells;Urban;Energy Procedia,2015
2. The composition dependence of internal stress, ultramicrohardness and electrical resistivity of binary alloy films containing silver, aluminium, gold, cobalt, copper, iron or nickel;Van den Broek;Thin Solid Films,1985
3. Formation of Ag/Al Screen-Printing Contacts on B Emitters;Fritz;IEEE J. Photovoltaics,2015
4. Resistivity Measurements on Germanium for Transistors;Valdes;Proc. I.R.E.,1954
5. Comsol Multiphysics® 5.1 version 5.1.0.180. Copyright 1998-2015.
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