FoilMet ® ‐Interconnect: Busbarless, electrically conductive adhesive‐free, and solder‐free aluminum interconnection for modules with shingled solar cells-Reference-Cited by-同舟云学术

FoilMet ® ‐Interconnect: Busbarless, electrically conductive adhesive‐free, and solder‐free aluminum interconnection for modules with shingled solar cells

Published:2021-09-15 Issue: Volume: Page:
ISSN:1062-7995
Container-title:Progress in Photovoltaics: Research and Applications
language:en
Short-container-title:Prog Photovolt Res Appl

Author:

Paschen Jan¹^ORCID,Baliozian Puzant¹,John Oliver¹,Lohmüller Elmar¹^ORCID,Rößler Torsten¹,Nekarda Jan¹

Affiliation:

1. Photovoltaics Fraunhofer Institute for Solar Energy Systems ISE Freiburg Germany

Funder

Bundesministerium für Wirtschaft und Energie

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pip.3470

Reference54 articles.

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3. OswaldM TurekM SchneiderJ SchoenfelderS.“Evaluation of silicon solar cell separation techniques for advanced module concepts ”28th European Photovoltaic Solar Energy Conference and Exhibition Paris France pp.1807‐1812 2013.

4. Mechanical damage of half‐cell cutting technologies in solar cells and module laminates;Kaule F;AIP Conf. Proc.,1999

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