Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference20 articles.
1. Microelectronics packaging — an overview;Rymaszewski,1989
2. Convection heat transfer in electronic equipment cooling;Incropera;ASME Journal of Heat Transfer,1988
3. Recent development of computer cooling technology;Chu,1993
4. Geometric optimization of cooling techniques;Bejan,1996
5. Experimental and numerical study on natural convection from vertical plates with horizontal rectangular grooves;Kwak;International Journal of Heat and Mass Transfer,1998
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献