Conduction trees with spacings at the tips
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference15 articles.
1. Constructal-theory network of conducting paths for cooling a heat generating volume;Bejan;International Journal of Heat and Mass Transfer,1997
2. Thermal control of electronic equipment and devices;Peterson;Advances in Heat Transfer,1990
3. Optimal thermal design of forced convection heat sinks-analytical;Knight;Journal of Electronic Packaging,1991
4. The effect of plate spacing on free convection between heated parallel plates;Anand;Journal of Heat Transfer,1992
5. Laminar developing flow and heat transfer between a series of parallel plates with surface mounted discrete heat sources;Kim;International Journal of Heat and Mass Transfer,1994
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