1. High power semiconductor rectifier equipment using boiling and condensing heat transfer;Otani;Proc. IAS Conf., 10th,1975
2. Considerations in device cooling;Electron. Packag. Prod.,1981
3. Direct heat pipe cooling of semiconductor devices;Nelson;Proc. Int. Heat Pipe Conf., 3rd,1978
4. J. S. Goodling, R. C. Jaeger, N. V. Williamson, C. D. Ellis, and T. D. Slagh, Wafer scale cooling using jet impingement boiling heat transfer. ASME Pap. No. 87-WA/EEP-3(1987).
5. Integral cap heat sink assembly for the IBM 4381 processor;Biskeborn;Proc. Int. Electron. Packag. Soc. Conf., 4th,1984