Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
Author:
Publisher
Elsevier BV
Subject
General Chemical Engineering,General Chemistry
Reference24 articles.
1. The Effect of Some Addition Agents on the Kinetics of Copper Electrodeposition from a Sulfate Solution
2. Some fundamental aspects of levelling and brightening in metal electrodeposition
3. A Radioisotopic Study of Leveling in Bright Nickel Electroplating Baths
4. Blocking Inhibitors in Cathodic Leveling: I. Theoretical Analysis
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