Surface activation of polyimide with dielectric barrier discharge for electroless metal deposition-Reference-Cited by-同舟云学术

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Surface activation of polyimide with dielectric barrier discharge for electroless metal deposition

Published:2000-03 Issue:1-3 Volume:125 Page:19-24
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Esrom Hilmar,Seeböck Robert,Charbonnier Marlène,Romand Maurice

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference30 articles.

1. Electroless Plating: Fundamentals and Applications,1990

2. Metallized Plastics 5 and 6: Fundamental and Applied Aspects;Karam,1998

3. Plasma Surface Engineering, Part I and II,1997

4. Metallized Plastics 5 and 6: Fundamental and Applied Aspects;Romand,1998

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2. Infrared Spectroscopy of $$\hbox {CH}_4/\hbox {N}_{2}$$ CH 4 / N 2 and $$\hbox {C}_{2}\hbox {H}_{m}/\hbox {N}_{2}$$ C 2 H m / N 2 ( $${m = 2, 4, 6}$$ m = 2 , 4 , 6 ) Gas Mixtures in a Dielectric Barrier Discharge;Plasma Chemistry and Plasma Processing;2014-05-10

3. Comparative Plasma Chemical Reaction Studies of CH4/Ar and C2Hm/Ar (m = 2,4,6) Gas Mixtures in a Dielectric Barrier Discharge;Contributions to Plasma Physics;2014-02-03

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