Electroless copper plating on PC engineering plastic with a novel palladium-free surface activation process-Reference-Cited by-同舟云学术

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Electroless copper plating on PC engineering plastic with a novel palladium-free surface activation process

Published:2014-07 Issue: Volume:251 Page:69-73
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Luo Lai-Ma,Lu Ze-Long,Huang Xin-Min,Tan Xiao-Yue,Ding Xiao-Yu,Cheng Ji-Gui,Zhu Liu,Wu Yu-Cheng

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference18 articles.

1. Surface modification of polyimide using dielectric barrier discharge treatment

2. New electroless copper plating bath using sodium hypophosphite as reductant

3. Research on a new surface activation process for electroless plating on ABS plastic

4. A novel activation for electroless plating on preparing Ni/PS microspheres

5. Microstructure and electromagnetic interference shielding effectiveness of electroless Ni–P plated polyester fabric

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4. Selective Metallization on Ordinary Polymer Substrates by Laser Direct Activation of Copper Phosphate or Nickel Phosphate;Langmuir;2023-01-26

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