Modeling and Simulation of Junction Temperature Rise of GaN Devices for Class D Resonant Converters

Author:

Teerakawanich Nithiphat,Srisonpan Siwapon,Ongrungroj Pongpol,Tangjitchutchawal Nawaporn

Publisher

Elsevier BV

Subject

General Engineering

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Extraction of the Thermal Resistance and the Thermal Capacitance of GaN Power HEMTs by Using Pulsed IV Measurements;IEEE Transactions on Electron Devices;2024-09

2. Gate Drive Optimization Framework with Electro-thermal Model of GaN HEMTs for High-Frequency DC-DC Converters;2021 IEEE Power and Energy Conference at Illinois (PECI);2021-04-01

3. A Virtual Lab for Demonstration of Temperature Measurement Errors Due to Transient Heat Transfer;2020 7th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE);2020-11-12

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