Author:
Chen Rong-Sheng,Lin Heng-cheng,Kung Chieh
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference13 articles.
1. Roark, Young, Formulas for stress and strain, fifth ed. New York: McGraw-Hill, 1975
2. Predicted residual bow of thin plastic packages of integrated circuit devices;Suhir;ASME J Electron Packaging,1992
3. Effect of heat slug and die attach material properties on plastic pin grid array (PPGA) package stress;Mertol;IEEE Trans Components Hybrids and Manufacturing Technol,1993
4. Accurate prediction of PQFP warpage;Kelly;Electronic Components and Technology Conference,1994
5. A method to predict cracking in IC plastic packages;Margaritis;IEEE Trans Components Packaging and Manufacturing Technol, Part B,1994
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17 articles.
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