Indentation on monocrystalline copper at cryogenic and ambient temperature-Reference-Cited by-同舟云学术

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Indentation on monocrystalline copper at cryogenic and ambient temperature

Published:2020-03 Issue: Volume:9 Page:100510
ISSN:2589-1529
Container-title:Materialia
language:en
Short-container-title:Materialia

Author:

Wang Shunbo,Liu Sihan,Zhao Dan,Wang Zhaoxin,Zhao Hongwei^ORCID

Funder

National Key R and D Program of China

Project of Basic Technical Research

General Armaments Department

Scientific and Technological Innovation

JLU Science and Technology Innovative Research Team

Jilin University

Publisher

Elsevier BV

Subject

General Materials Science

Reference16 articles.

1. Crystal plasticity finite element simulations of pyramidal indentation in copper single crystals;Casals;Acta Mater.,2007

2. Nanoindentation behavior of nanotwinned Cu: Influence of indenter angle on hardness, strain rate sensitivity andactivation volume;Choi;Acta Mater.,2013

3. The correlation of the indentation size effect measured with indenters of various shapes;Swadener;J. Mech. Phys. Solids,2002

4. Deformation underneath low-load indentations in copper;McLaughlin;J. Phys. D Appl. Phys.,2008

5. A combined experimental-numerical approach for determining mechanical properties of aluminum subjects to nanoindentation;Liu;Sci. Rep.,2015

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1. Development of modular cryogenic indentation apparatus for investigating micro-region mechanical properties of materials;Journal of Materials Research and Technology;2023-11

2. A minimized and efficient low temperature loading device for indentation;Review of Scientific Instruments;2022-09-01

3. A study of effect factors on thermal drift rates during cryogenic indentation via Taguchi design and finite element method;Materials & Design;2022-07

4. Understanding imprint formation, plastic instabilities and hardness evolutions in FCC, BCC and HCP metal surfaces;Acta Materialia;2021-09

5. Low Temperature Nanoindentation: Development and Applications;Micromachines;2020-04-13

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