Deformation underneath low-load indentations in copper
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0022-3727/41/i=7/a=074007/pdf
Reference23 articles.
1. Micro- and nanoindentation techniques for mechanical characterisation of materials
2. Contact of characterised metal surfaces at very low loads: Deformation and adhesion
3. The frictional component of the indentation size effect in low load microhardness testing
4. Dislocation distribution under a microindentation into an iron-silicon single crystal
5. Microstructural evolution of the deformed volume beneath microindents in tungsten and copper
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