Subject
General Materials Science
Reference92 articles.
1. Technology and reliability constrained future copper interconnects. I. Resistance modeling;Kapur;IEEE Trans. Electron Devices,2002
2. Beyond Moore's Law: the interconnect era;Meindl;Comput. Sci. Eng.,2003
3. Size-Dependent resistivity in nanoscale interconnects;Josell;Annu. Rev. Mater. Res.,2009
4. Advanced interconnects: materials, processing, and reliability;Baklanov;ECS J. Solid State Sci. Technol.,2014
5. Process technology scaling in an increasingly interconnect dominated world;Clarke;2014 IEEE Symp. VLSI Technol.,2014
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献