Effect of sputtering parameters on the adhesion force of copper/molybdenum metal on polymer substrate-Reference-Cited by-同舟云学术

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Effect of sputtering parameters on the adhesion force of copper/molybdenum metal on polymer substrate

Published:2011-09 Issue:5 Volume:11 Page:S12-S15
ISSN:1567-1739
Container-title:Current Applied Physics
language:en
Short-container-title:Current Applied Physics

Author:

Lee Sang-Hyuk,Park In-Sun,Seo Bo-Hyun,Seo Jong Hyun,Choe Heehwan,Jeon Jae-Hong,Lee Yong Uk,Hong Munpyo

Publisher

Elsevier BV

Subject

General Physics and Astronomy,General Materials Science

Reference9 articles.

1. IMID 05;Seo;Digest,2005

2. SID 10;Seo;Digest,2010

3. Stimuli-responsive Polymeric Films and Coatings;Lim,2005

4. A new test methodology for evaluating scratch resistance of polymers

5. A review of the methods for the evaluation of coating-substrate adhesion

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2. Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film;Surface Topography: Metrology and Properties;2022-10-19

3. Microstructure and residual stress dependence of molybdenum films on DC magnetron sputtering conditions;Applied Physics A;2022-10-13

4. Wear Characterization of Chromium PVD Coatings on Polymeric Substrate for Automotive Optical Components;Coatings;2021-05-08

5. Structural, chemical and mechanical study of TiAlV film on UHMWPE produced by DC magnetron sputtering;Journal of the Mechanical Behavior of Biomedical Materials;2019-05

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