Development and evaluation of a Cu composite sheet with embedded high electric conduction path for new interconnect material-Reference-Cited by-同舟云学术

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Development and evaluation of a Cu composite sheet with embedded high electric conduction path for new interconnect material

Published:2011-01 Issue:1 Volume:11 Page:S283-S288
ISSN:1567-1739
Container-title:Current Applied Physics
language:en
Short-container-title:Current Applied Physics

Author:

Shin Je-sik,Moon Hyung-kwon,Kim Bong-hwan,Kim Kyung-hoon,Lee Hyo-soo,Jung Seung-boo,Kwon Hyouk-chon

Publisher

Elsevier BV

Subject

General Physics and Astronomy,General Materials Science

Reference15 articles.

1. Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures;Strehle;Microelectronic Engineering,2009

2. Kinetics of oxidation of copper alloy leadframes;Lahiri;Microelectronics Journal,1998

3. Oxidation studies on a Cu-base leadframe alloy between 150°C and 300°C;Cho;Scripta Materialia,1998

4. High-Strength, high-conductivity copper-steel composite;Zhou;Materials Characterization,1996

5. High strain rate superplasticity of deformation processed Cu–Ag filamentary composites;Hong;Scripta Materialia,2004

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Facile Solvothermal Synthesis of Porous Cubic Cu Microparticles as Copper Catalysts for Rochow Reaction;ACS Applied Materials & Interfaces;2012-03-06

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