Author:
Meng Binbin,Yuan Dandan,Xu Shaolin
Funder
National Natural Science Foundation of China
Natural Science Foundation of Guangdong Province
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Civil and Structural Engineering
Reference30 articles.
1. Surface and subsurface damage characteristics and material removal mechanism in 6H-SiC wafer grinding;Yan;Mater Res In nov,2014
2. Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining;Yin;Int J Mach Tools Manuf,2004
3. Experimental study of surface performance of monocrystalline 6H-SiC substrates in plane grinding with a metal-bonded diamond wheel;Pan;Int J Adv Manuf Technol,2017
4. Investigation on mirror surface grinding characteristics of SiC materials;Kasuga;J Ceram Process Res,2009
5. Nanogrinding of SiC wafers with high flatness and low subsurface damage;Huo;Trans Nonferrous Met Soc China English Ed,2012
Cited by
89 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献