Atomistic understanding of ductile-to-brittle transition in single crystal Si and GaAs under nanoscratch

Author:

Li Xuliang,Bonilla Mauricio Rincón,Lu MingyuanORCID,Huang HanORCID

Funder

Australian National Fabrication Facility

University of Queensland

Australian Research Council

Publisher

Elsevier BV

Reference96 articles.

1. Science and art of ductile grinding of brittle solids;Huang;Int J Mach Tools Manuf,2021

2. Deformation and removal of semiconductor and laser single crystals at extremely small scales;Wu;Int J Extreme Manuf,2020

3. Threshold damage mechanisms in brittle solids and their impact on advanced technologies;Lawn;Acta Mater,2022

4. Grinding of silicon wafers: a review from historical perspectives;Pei;Int J Mach Tools Manuf,2008

5. Damage formation and suppression in rotary ultrasonic machining of hard and brittle materials: a critical review;Wang;Ceram Int,2018

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