Evolution of penny-shaped microcracks by interface migration-Reference-Cited by-同舟云学术

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Evolution of penny-shaped microcracks by interface migration

Published:2003-04 Issue:8 Volume:40 Page:1959-1972
ISSN:0020-7683
Container-title:International Journal of Solids and Structures
language:en
Short-container-title:International Journal of Solids and Structures

Author:

Huang Peizhen,Sun Jun,Li Zhonghua

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation

Reference35 articles.

1. Tip shape evolution: capillarity-induced matter transport by surface diffusion. I;Binh;Surf. Sci.,1987

2. Mass transport by surface self-diffusion;Bonzel,1983

3. The morphological stability of continuous intergranular phases: thermodynamic considerations;Carter;Acta Metall.,1987

4. Variational methods for microstructural-evolution theories;Carter;JOM-J. Min. Met. Mat. S.,1997

5. Diffusional crack healing in quartz;David;J. Geophys. Res.,1984

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1. Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration;European Journal of Mechanics - A/Solids;2022-07

2. Phase field simulation of the void destabilization and splitting processes in interconnects under electromigration induced surface diffusion;Modelling and Simulation in Materials Science and Engineering;2021-12-03

3. The evolution of intragranular microcracks caused by interface migration induced by electromigration;Journal of Mechanics of Materials and Structures;2021-11-09

4. Morphology Evolution and Mechanisms of Crack Healing in a Low-Carbon Steel During Isothermal Heat Treatment;Metallurgical and Materials Transactions A;2021-04-29

5. Effect of interconnect linewidth on the evolution of intragranular microcracks due to surface diffusion in a gradient stress field and an electric field;Journal of Mechanics of Materials and Structures;2018-08-31

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