Structure and mechanical properties of W incorporated diamond-like carbon films prepared by a hybrid ion beam deposition technique
Author:
Publisher
Elsevier BV
Subject
General Chemistry,General Materials Science
Reference24 articles.
1. Tribology of diamond-like carbon coated VCR head drums;Lee;Mater Sci Eng A,1996
2. Superhard, functionally gradient, nanolayered and nanocomposite diamond-like carbon coatings for wear protection;Voevodin;Diamond Relat Mater,1998
3. From alloying to nanocomposites-improved performance of hard coatings;Hauert;Adv Eng Mater,2000
4. Stress generation mechanisms in carbon thin films grown by ion-beam deposition;Zhang;Acta Mater,2003
5. Hardness, elastic modulus, and structure of very hard carbon films produced by cathodic-arc deposition with substrate pulse biasing;Pharr;Appl Phys Lett,1996
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