High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite-Reference-Cited by-同舟云学术

High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite

Published:2020-10 Issue: Volume:168 Page:553-563
ISSN:0008-6223
Container-title:Carbon
language:en
Short-container-title:Carbon

Author:

Lei L.,Bolzoni L.,Yang F.

Funder

Air Force Office of Scientific Research

Publisher

Elsevier BV

Subject

General Chemistry,General Materials Science

Reference65 articles.

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3. Metal-level thermally conductive yet soft graphene thermal interface materials;Dai;ACS Nano,2019

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5. Understanding the thermal conductivity of diamond/copper composite by first-principles calculations;Chen;Carbon,2019

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