Carbon black pastes as coatings for improving thermal gap-filling materials

Author:

Leong Chia-Ken,Aoyagi Yasuhiro,Chung D.D.L.

Publisher

Elsevier BV

Subject

General Chemistry,General Materials Science

Reference20 articles.

1. Prediction of thermal contact resistance between polished surfaces;Wolff;Int J Heat Mass Transfer,1998

2. Ouellette T, de Sorgo M. Thermal performance of heat transfer interface materials. In: Proceedings of the power electronics design conference, power sources users conference, Cerritos, CA, 1985, p. 134–8.

3. Thermal performance for a miniature heat sink cooled by microPCM slurry;Vogel,1995

4. Enhancement of thermal contact conductance for electronic systems;Sartre;Appl Therm Eng,2001

5. The effect of thermal contact resistance on heat management in the electronic packaging;Grujicic;Appl Surf Sci,2005

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